Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Curtis Zwenger | 2024-12-31 |
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2024-12-03 |
| 12141320 | Secure permissioning of access to user accounts, including secure distribution of aggregated user account data | William Hockey, Joy Zheng, Baker Shogry | 2024-11-12 |
| 12136565 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2024-11-05 |
| 12040305 | Shielded electronic component package | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2024-07-16 |
| 12021854 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2024-06-25 |
| 11901335 | Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch | Ronald Patrick Huemoeller, David Jon Hiner | 2024-02-13 |