Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2024-12-03 |
| 12051611 | Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby | Young Do Kweon | 2024-07-30 |
| 12009343 | Stackable package and method | Robert Francis Darveaux, Vladimir Perelman | 2024-06-11 |
| 11876039 | Semiconductor devices and methods of manufacturing semiconductor devices | Louis W. Nicholls | 2024-01-16 |