Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165986 | Semiconductor package using cavity substrate and manufacturing methods | JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2024-12-10 |
| 12051611 | Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby | Roger D. St. Amand | 2024-07-30 |