Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165986 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, JeongByung Chae, ByoungWoo Cho, SeHwan Hong | 2024-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165986 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, JeongByung Chae, ByoungWoo Cho, SeHwan Hong | 2024-12-10 |