JC

JeongByung Chae

AP Amkor Technology Singapore Holding Pte.: 1 patents #58 of 190Top 35%
Overall (2024): #423,245 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12165986 Semiconductor package using cavity substrate and manufacturing methods Young Do Kweon, DongJoo Park, ByoungWoo Cho, SeHwan Hong 2024-12-10