Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033954 | Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same | Howard E. Chen, David Viveiros, Jr., Russ Alan Reisner | 2024-07-09 |
| 12009343 | Stackable package and method | Roger D. St. Amand, Vladimir Perelman | 2024-06-11 |
| 11974390 | Reduction of packaging substrate deformation | Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen | 2024-04-30 |
| 11961805 | Devices and methods related to dual-sided radio-frequency package with overmold structure | Howard E. Chen | 2024-04-16 |
| 11894323 | Devices related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2024-02-06 |