Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033954 | Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same | Howard E. Chen, Russ Alan Reisner, Robert Francis Darveaux | 2024-07-09 |