Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12164147 | Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip | Changhua Liu, Zhichao Zhang, Liang Zhang | 2024-12-10 |
| 12087658 | Hybrid thermal interface material (TIM) with reduced 3D thermal resistance | Joe Walczyk | 2024-09-10 |
| 12074138 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly | 2024-08-27 |
| 12057370 | Vacuum modulated two phase cooling loop efficiency and parallelism enhancement | Paul Diglio, David Shia | 2024-08-06 |
| 12032002 | Chevron interconnect for very fine pitch probing | — | 2024-07-09 |
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Chandra Mohan Jha, Aastha Uppal, Weihua Tang, Paul Diglio, Xavier Francois Brun | 2024-06-25 |
| 11984430 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly | 2024-05-14 |
| 11976671 | Vacuum modulated two phase cooling loop performance enhancement | Paul Diglio, David Shia | 2024-05-07 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun | 2024-05-07 |