Issued Patents 2024
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154783 | Semiconductor wafer and method of wafer thinning | — | 2024-11-26 |
| 12154877 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2024-11-26 |
| 12148665 | Jet ablation die singulation systems and related methods | — | 2024-11-19 |
| 12132008 | Multidie supports and related methods | Francis J. Carney | 2024-10-29 |
| 12132005 | Supports for thinned semiconductor substrates and related methods | Francis J. Carney | 2024-10-29 |
| 12119294 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2024-10-15 |
| 12094750 | Tape heating methods | — | 2024-09-17 |
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-07-16 |
| 12040295 | Semiconductor device with backmetal and related methods | Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN | 2024-07-16 |
| 12020972 | Curved semiconductor die systems and related methods | Francis J. Carney | 2024-06-25 |
| 11987874 | Backside metal formation methods and systems | — | 2024-05-21 |
| 11972980 | Singulation systems and related methods | — | 2024-04-30 |
| 11948880 | SOI substrate and related methods | Mark Griswold | 2024-04-02 |
| 11942366 | Backside metal patterning die singulation systems and related methods | — | 2024-03-26 |
| 11929285 | Backside metal patterning die singulation system and related methods | — | 2024-03-12 |
| 11908699 | Semiconductor packages with die including cavities | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-20 |
| 11901184 | Backmetal removal methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-13 |
| 11894245 | Non-planar semiconductor packaging systems and related methods | Francis J. Carney | 2024-02-06 |