Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | James C. Matayabas, Jr., Zhimin Wan, Kyle Arrington | 2024-07-23 |
| 12048123 | Heat dissipation device having shielding/containment extensions | Aastha Uppal, Ravindranath V. Mahajan | 2024-07-23 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Zhimin Wan, Shankar Devasenathipathy | 2024-02-13 |