Issued Patents 2024
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more | 2024-12-31 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12166261 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-12-10 |
| 12155372 | Multi-filter die | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov | 2024-11-26 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12126067 | Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12126068 | Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12107314 | Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad | Neelam Prabhu Gaunkar, Telesphor Kamgaing, Henning Braunisch, Diego Correas-Serrano | 2024-10-01 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more | 2024-09-10 |
| 12088360 | Dispersive waveguide crosstalk mitigation | Henning Braunisch, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more | 2024-09-10 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2024-07-16 |
| 12040307 | Magnetic induced heating for solder interconnects | Feras Eid, Adel A. Elsherbini | 2024-07-16 |
| 12021289 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-06-25 |
| 12007170 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan | 2024-06-11 |
| 11990419 | Physically unclonable function circuitry of a package substrate and method of providing same | Feras Eid, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker | 2024-05-21 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan | 2024-05-14 |
| 11955684 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-04-09 |
| 11916604 | Dispersion compensation for electromagnetic waveguides | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more | 2024-02-27 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Adel A. Elsherbini, Feras Eid | 2024-02-06 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Feras Eid, Adel A. Elsherbini | 2024-01-30 |