Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068283 | Die stack with cascade and vertical connections | Min-Tih Lai, Yuhong Cai, John G. Meyers | 2024-08-20 |
| 11948917 | Die over mold stacked semiconductor package | Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
| 11901264 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Yi Xu | 2024-02-13 |
| 11901274 | Packaged integrated circuit device with recess structure | Bin Liu, John G. Meyers | 2024-02-13 |