Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068283 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, Yuhong Cai | 2024-08-20 |
| 11901274 | Packaged integrated circuit device with recess structure | Bin Liu, Florence R. Pon | 2024-02-13 |