Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176298 | Floating die package | Steven Kummerl, Kurt Peter Wachtler | 2024-12-24 |
| 12172374 | Additive process for circular printing | Daniel Lee Revier, Sean Chang | 2024-12-24 |
| 12148717 | Through wafer trench isolation between transistors in an integrated circuit | Scott R. Summerfelt, Thomas D. Bonifield, Sreeram Subramanyam Nasum, Peter Smeys | 2024-11-19 |
| 12139569 | Filler particles for polymers | Nazila Dadvand, Archana Venugopal, Luigi Colombo | 2024-11-12 |
| 12080633 | Custom leadframe from standard plus printed leadframe portion | Jo Bito, Steven Kummerl | 2024-09-03 |
| 12054385 | Stress isolation using three-dimensional trenches | Ting-Ta Yen, Jeronimo SEGOVIA-FERNANDEZ, Ricky Alan Jackson | 2024-08-06 |
| 12042829 | Methods and apparatus for surface wetting control | Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan | 2024-07-23 |
| 12046430 | Liquid metal MEMS switch | Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier | 2024-07-23 |
| 11996343 | Thermal routing trench by additive processing | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2024-05-28 |
| 11948871 | Process for thin film capacitor integration | Yogesh Kumar Ramadass, Salvatore Frank Pavone, Mahmud Halim Chowdhury | 2024-04-02 |
| 11938715 | SP2-bonded carbon structures | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2024-03-26 |
| 11908776 | Semiconductor device with metal die attach to substrate with multi-size cavity | Nazila Dadvand, Sreenivasan K. Koduri | 2024-02-20 |
| 11869864 | Nanowires plated on nanoparticles | Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2024-01-09 |
| 11869925 | 3D printed semiconductor package | Daniel Lee Revier | 2024-01-09 |
| 11865773 | Additive process for circular printing of electronic devices | Daniel Lee Revier, Sean Chang | 2024-01-09 |