Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |