Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12102542 | Interspinous spacer and methods and systems utilizing the interspinous spacer | — | 2024-10-01 |
| 12074137 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12027470 | Package carrier having a stiffener between solder bumps | Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |
| 12013284 | Optical sensor module and packaging method thereof | Feng-Jung Hsu | 2024-06-18 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Sheng-Tsai Wu, Wen-Hung Liu, Ang-Ying Lin, Chang-Sheng Chen | 2024-06-11 |
| 11942396 | Heterogeneous integration semiconductor package structure | Heng-Chieh Chien, Shu-Jung Yang, Chih-Yao Wang, Yu-Lin Chao | 2024-03-26 |