Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074137 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Yu-Min Lin, Wen-Hung Liu, Ang-Ying Lin, Chang-Sheng Chen | 2024-06-11 |