Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074137 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Po-Chih Chang | 2024-07-02 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Sheng-Tsai Wu, Yu-Min Lin, Wen-Hung Liu, Chang-Sheng Chen | 2024-06-11 |