Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |