Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin | 2024-07-02 |
| 12015748 | Dual-axle linkage detection structure | Sung-Po Lin, Tzu-Cheng Chang | 2024-06-18 |
| 11858272 | Ink circulation system | Pei-Chi Ho, Ya Ching Tung, Chi-Kuang Shen, Shou-Chih Sun, Yao-Te Huang | 2024-01-02 |