Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942396 | Heterogeneous integration semiconductor package structure | Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942396 | Heterogeneous integration semiconductor package structure | Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao | 2024-03-26 |