Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009289 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, KooWoong Jeong +5 more | 2024-06-11 |
| 11935758 | Atomic layer etching for subtractive metal etch | Wenbing Yang, Mohand Brouri, Samantha Tan, Shih-Ked Lee, Yiwen FAN +3 more | 2024-03-19 |