Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2024-08-06 |
| 12009289 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2024-06-11 |