Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12167102 | Multicast in the probe channel | Vydhyanathan Kalyanasundharam, Joe Griffith Cruz, Eric Christopher Morton | 2024-12-10 | $237,856,000 |
| 12107076 | Through-silicon via layout for multi-die integrated circuits | Wonjun Jung, Jasmeet Singh Narang, Tyrone Tung Huang, Christopher Klement, Edward Chang +1 more | 2024-10-01 | $299,271,000 |
| 11995351 | DMA engines configured to perform first portion data transfer commands with a first DMA engine and second portion data transfer commands with second DMA engine | Joseph L. Greathouse, Sean Keely, Anthony Asaro, Ling Wang, Milind N. Nemlekar +2 more | 2024-05-28 | $447,351,000 |
| 11960339 | Multi-die stacked power delivery | Eric J. Chapman, Edward Chang | 2024-04-16 | $289,510,000 |