Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12107076 | Through-silicon via layout for multi-die integrated circuits | Wonjun Jung, Jasmeet Singh Narang, Tyrone Tung Huang, Christopher Klement, Alan Dodson Smith +1 more | 2024-10-01 | $299,271,000 |
| 11960339 | Multi-die stacked power delivery | Eric J. Chapman, Alan Dodson Smith | 2024-04-16 | $289,510,000 |