Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12107076 | Through-silicon via layout for multi-die integrated circuits | Wonjun Jung, Jasmeet Singh Narang, Tyrone Tung Huang, Alan Dodson Smith, Edward Chang +1 more | 2024-10-01 | $299,271,000 |