Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174771 | Sharing package pins in a multi-chip module (MCM) | Yulei Shen, Chen-Kuan Hong | 2024-12-24 |
| 12107076 | Through-silicon via layout for multi-die integrated circuits | Wonjun Jung, Jasmeet Singh Narang, Christopher Klement, Alan Dodson Smith, Edward Chang +1 more | 2024-10-01 |
| 11886370 | Sharing package pins in a multi-chip module (MCM) | Yulei Shen, Chen-Kuan Hong | 2024-01-30 |