Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792918 | Co-axial via structure | Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng | 2023-10-17 |
| 11641720 | Circuit board and manufacturing method thereof | Shao-Chien Lee, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang +1 more | 2023-05-02 |
| 11600936 | Circuit board structure | Tzyy-Jang Tseng, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2023-03-07 |
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng | 2023-01-24 |
| 11545412 | Package structure and manufacturing method thereof | Ching-Sheng Chen, Ra-Min Tain, Ming-Hao Wu, Hsuan-Wei Chen | 2023-01-03 |