Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Kai-Ming Yang, Chia-Yu Peng | 2023-11-21 |
| 11808787 | Probe card testing device | Tzyy-Jang Tseng, Kuo Ching Tien, Ra-Min Tain | 2023-11-07 |
| 11710690 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11682612 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng +2 more | 2023-05-30 |
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2023-01-24 |