Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764344 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang | 2023-09-19 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11690180 | Manufacturing method of carrier structure | Tzyy-Jang Tseng, Pu-Ju Lin, Tse-Wei Wang | 2023-06-27 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng +2 more | 2023-05-30 |
| 11637047 | Manufacturing method of chip package structure | Pu-Ju Lin, Kai-Ming Yang | 2023-04-25 |