Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |