Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Kai-Ming Yang, John Hon-Shing Lau | 2023-11-21 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang +2 more | 2023-05-30 |