Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Pei-Wei Wang | 2023-01-24 |