Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545412 | Package structure and manufacturing method thereof | Pei-Wei Wang, Ching-Sheng Chen, Ra-Min Tain, Ming-Hao Wu | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545412 | Package structure and manufacturing method thereof | Pei-Wei Wang, Ching-Sheng Chen, Ra-Min Tain, Ming-Hao Wu | 2023-01-03 |