Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792918 | Co-axial via structure | Pei-Wei Wang, Heng-Ming Nien, Yi-Pin Lin, Shih-Liang Cheng | 2023-10-17 |
| 11785707 | Circuit board and manufacturing method thereof and electronic device | Chih-Chiang Lu, Heng-Ming Nien, Ching-Shiang Chang, Ming-Ting Chang, Chi-Min Chang +3 more | 2023-10-10 |
| 11545412 | Package structure and manufacturing method thereof | Pei-Wei Wang, Ra-Min Tain, Ming-Hao Wu, Hsuan-Wei Chen | 2023-01-03 |