Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11703459 | System and method to calibrate a plurality of wafer inspection system (WIS) modules | Michael A. Carcasi, Hiroyuki Iwaki, Masahide Tadokoro | 2023-07-18 |
| 11636579 | Information processing method, information processing apparatus and computer-readable recording medium | Masato Hosaka | 2023-04-25 |
| 11555691 | Substrate inspection system, substrate inspection method and recording medium | Hiroshi Nakamura, Yasuaki Noda | 2023-01-17 |
| 11544864 | Shape characteristic value estimation apparatus, shape characteristic value estimation method, and storage medium | Yusuke YODA, Masato Hosaka | 2023-01-03 |