Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830832 | Semiconductor structure and manufacturing method thereof | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2023-11-28 |
| 11754621 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2023-09-12 |
| 11630149 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2023-04-18 |
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2023-03-28 |