Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830806 | Semiconductor structure and method of manufacturing the same | Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Mingni Chang, Ming-Yih Wang | 2023-11-28 |
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Yih Wang, Yinlung Lu | 2023-03-28 |