Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu | 2023-03-28 |
HC
Hsin Chang
Overall (2023): #420,826 of 537,848Top 80%
1
Patents 2023