Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11754621 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Yung-Liang Kuo, Yinlung Lu | 2023-09-12 |
| 11630149 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Yung-Liang Kuo, Yinlung Lu | 2023-04-18 |