Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820058 | Injection mould and injection moulding method | Jie Liu, Changhao Quan, Zhan Ying | 2023-11-21 |
| 11754621 | Method and device for wafer-level testing | Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu | 2023-09-12 |
| D985668 | Erasable doodle book | — | 2023-05-09 |
| 11630149 | Method and system for wafer-level testing | Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu | 2023-04-18 |
| 11631516 | Inductor stack structure | Wei CHENG, Chengjie Zuo | 2023-04-18 |
| 11599417 | Error correction system | Kangling Ji, Yuanyuan Gong, Zhan Ying | 2023-03-07 |