Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2023-08-15 |
YL
Yi-Hang Lin
Overall (2023): #196,739 of 537,848Top 40%
1
Patents 2023