Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842976 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Mingchih Chen | 2023-12-12 |
| 11798888 | Chip packaging structure and method for preparing same | Yayuan Xue, Xingtao Xue | 2023-10-24 |
| 11756942 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-12 |
| 11756871 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-12 |
| 11749657 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-05 |
| 11735564 | Three-dimensional chip packaging structure and method thereof | Yenheng Chen, Chengtar Wu | 2023-08-22 |
| 11728558 | Semiconductor structure including antenna | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2023-08-15 |
| 11728158 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Xingtao Xue | 2023-08-15 |
| 11699840 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2023-07-11 |
| 11626657 | Antenna packaging module and making method thereof | Chengtar Wu, Rui Yu, Xianghui Zhang | 2023-04-11 |
| 11605604 | Fan-out antenna packaging structure and packaging method | Yenheng Chen | 2023-03-14 |