Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735564 | Three-dimensional chip packaging structure and method thereof | Yenheng Chen, Chengchung Lin | 2023-08-22 |
| 11728558 | Semiconductor structure including antenna | Yenheng Chen, Jangshen Lin, Chengchung Lin | 2023-08-15 |
| 11699840 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2023-07-11 |
| 11626657 | Antenna packaging module and making method thereof | Rui Yu, Chengchung Lin, Xianghui Zhang | 2023-04-11 |