Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756942 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-12 |
| 11756871 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-12 |
| 11749657 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-05 |
| 11735564 | Three-dimensional chip packaging structure and method thereof | Chengchung Lin, Chengtar Wu | 2023-08-22 |
| 11735554 | Wafer-level chip scale packaging structure having a rewiring layer and method for manufacturing the wafer-level chip scale packaging structure | Chenguang Yin | 2023-08-22 |
| 11728558 | Semiconductor structure including antenna | Chengtar Wu, Jangshen Lin, Chengchung Lin | 2023-08-15 |
| 11699840 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2023-07-11 |
| 11605604 | Fan-out antenna packaging structure and packaging method | Chengchung Lin | 2023-03-14 |