Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842976 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Chengchung Lin | 2023-12-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842976 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Chengchung Lin | 2023-12-12 |