Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798888 | Chip packaging structure and method for preparing same | Yayuan Xue, Chengchung Lin | 2023-10-24 |
| 11728158 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Chengchung Lin | 2023-08-15 |