Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810862 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2023-11-07 |
| 11792938 | Method for fabricating carrier structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2023-10-17 |
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Don-Son Jiang | 2023-09-19 |
| 11742296 | Electronic package and manufacturing method thereof | Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Don-Son Jiang +2 more | 2023-08-29 |
| 11676948 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chi-Hsin Chiu | 2023-06-13 |
| 11605554 | Flip-chip process and bonding equipment | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2023-03-14 |