Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791300 | Electronic package and circuit structure thereof | Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son TSAI | 2023-10-17 |
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Chang-Fu Lin, Don-Son Jiang | 2023-09-19 |