Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791300 | Electronic package and circuit structure thereof | Chia-Yu Kuo, Pei-Geng Weng, Wei-Son TSAI, Yih-Jenn Jiang | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791300 | Electronic package and circuit structure thereof | Chia-Yu Kuo, Pei-Geng Weng, Wei-Son TSAI, Yih-Jenn Jiang | 2023-10-17 |